The app contains program and further information about the 4th ISTA European Packaging Symposium, organized by ISTA and the Fraunhofer Institute IML, which will be held November 6 & 7 at Fraunhofer’s facilities in Dortmund, Germany. Speakers including Ericsson, CHEP, Bonn University, Lufthansa Cargo, BSH, HP, BFSV, DHL, Smithers-PIRA, Sealed Air, Fraunhofer IML, INCPEN, and others, will bring case studies as well as new information during this valued event.

This Symposium offers rich opportunity for increasing brand value by delivering reduced damage, reduced costs and elimination of unnecessary use of materials, as well enhanced customer service through increased reliability and improved lead times. Attend the event, meet the industry experts, and learn how to access this unlocked value.